JPS5741301A - Production of powder coated with noble metal - Google Patents
Production of powder coated with noble metalInfo
- Publication number
- JPS5741301A JPS5741301A JP55116482A JP11648280A JPS5741301A JP S5741301 A JPS5741301 A JP S5741301A JP 55116482 A JP55116482 A JP 55116482A JP 11648280 A JP11648280 A JP 11648280A JP S5741301 A JPS5741301 A JP S5741301A
- Authority
- JP
- Japan
- Prior art keywords
- nobel
- aqueous
- metallic
- hydrogen peroxide
- alkalizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000510 noble metal Inorganic materials 0.000 title abstract 2
- 239000000843 powder Substances 0.000 title abstract 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- 230000003113 alkalizing effect Effects 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 3
- 239000013522 chelant Substances 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000006185 dispersion Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910021645 metal ion Inorganic materials 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical class [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical class OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical class [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000003349 gelling agent Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical class [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Chemical class 0.000 abstract 1
- 150000001455 metallic ions Chemical class 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/18—Non-metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Chemically Coating (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55116482A JPS5741301A (en) | 1980-08-26 | 1980-08-26 | Production of powder coated with noble metal |
| US06/251,746 US4450188A (en) | 1980-04-18 | 1981-04-07 | Process for the preparation of precious metal-coated particles |
| EP81303778A EP0046657B1 (en) | 1980-08-26 | 1981-08-19 | Process for the preparation of precious-metal coated particles |
| DE8181303778T DE3164569D1 (en) | 1980-08-26 | 1981-08-19 | Process for the preparation of precious-metal coated particles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55116482A JPS5741301A (en) | 1980-08-26 | 1980-08-26 | Production of powder coated with noble metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5741301A true JPS5741301A (en) | 1982-03-08 |
| JPS6122029B2 JPS6122029B2 (en]) | 1986-05-29 |
Family
ID=14688196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55116482A Granted JPS5741301A (en) | 1980-04-18 | 1980-08-26 | Production of powder coated with noble metal |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0046657B1 (en]) |
| JP (1) | JPS5741301A (en]) |
| DE (1) | DE3164569D1 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5272349B2 (ja) * | 2007-02-26 | 2013-08-28 | 東レ株式会社 | 電子放出源用ペースト及び電子放出素子 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3486928A (en) * | 1965-10-21 | 1969-12-30 | Int Nickel Co | Bath and process for platinum and platinum alloys |
| FR1569258A (en]) * | 1967-06-20 | 1969-05-30 | ||
| GB1558762A (en) * | 1975-07-04 | 1980-01-09 | Johnson Matthey Co Ltd | Metal or alloy coated powders |
| CH633497A5 (de) * | 1977-03-30 | 1982-12-15 | Kernforschungsanlage Juelich | Verfahren zur reduktion von reduzierbaren schadstoffen in waessrigen loesungen. |
-
1980
- 1980-08-26 JP JP55116482A patent/JPS5741301A/ja active Granted
-
1981
- 1981-08-19 EP EP81303778A patent/EP0046657B1/en not_active Expired
- 1981-08-19 DE DE8181303778T patent/DE3164569D1/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| EP0046657A1 (en) | 1982-03-03 |
| DE3164569D1 (en) | 1984-08-09 |
| JPS6122029B2 (en]) | 1986-05-29 |
| EP0046657B1 (en) | 1984-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5754296A (en) | Plating liquid for palladium nickel alloy | |
| JPS57164984A (en) | Exfoliating solution for tin or tin alloy | |
| TW374030B (en) | Copper fine powder and method for preparing the same | |
| CA2168013C (en) | Alkaline ammoniacal cupric chloride etching bath containing a copper (i) stabilizer | |
| CN103422078B (zh) | 一种化学镀铜液及其制备方法 | |
| GB1386375A (en) | Nickel-plating of metals | |
| CN101906649A (zh) | 无氰电镀金的镀液及采用无氰电镀金的镀液电镀金的方法 | |
| CN103132080A (zh) | 一种防铜氧化变色剂及其制备方法 | |
| DE2723910C2 (de) | Zusatzgemisch und dessen Verwendung für Bäder zur elektrolytischen Abscheidung von Gold oder Goldlegierungen | |
| GB2593660A (en) | Metallic coated substrates | |
| JPS5741301A (en) | Production of powder coated with noble metal | |
| CN110195222A (zh) | 一种rtr减铜后处理用铜箔表面钝化剂及其使用和制备方法 | |
| US3837945A (en) | Process of etching copper circuits with alkaline persulfate and compositions therefor | |
| JPS53134759A (en) | Production of copmosite metal powder | |
| GB1315548A (en) | Stabilized nickel plating compositions | |
| JPS56150101A (en) | Preparation of powder coated with noble metal | |
| CN108425145A (zh) | 一种无毒铜铁基银退镀液及其退镀工艺 | |
| JPS57140891A (en) | Pretreating solution for silver plating | |
| JPS57156416A (en) | Platinum (2) complex and antitumor agent comprising it as active ingredient | |
| JP2943296B2 (ja) | 銅又は銅合金の黒化処理方法及び黒化処理液 | |
| KR830005396A (ko) | 수소 방출 전극의 제조방법 | |
| Shih et al. | Study of the mechanism of additives on copper dissolution in monoethanolamine-complexed cupric ion solution | |
| SU910845A1 (ru) | Раствор дл травлени меди | |
| JPS5743978A (en) | Nickel electroless plating method | |
| JPH0250990B2 (en]) |